MULTI-FUNCTIONAL WIRE BONDER(Gold Ribbon)
S450-RW
FEATURES：
1. Close loop force control
2. DSP phase lock, stable ultrasonic output
3. Excellent fine wire control and super adaptability for soft substrates
4. Drive by electricity without compressed air
5. Self-study Chinese GUl for advanced process
TECHNICAL SPECIFICATION
| Bond Wire | Gold Ribbon(50 x 12.5μm~300 x 25.4μm) |
|---|---|
| Device Depth | Max:21mm |
| Type of Bonding Tools | 16mm Ball Bonding Tools； 19mm,25mm Wedge Bonding Tools |
| Spool | Standard :1/2 inch；Optional : 2 inch |
| Bond Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
|---|---|
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Lifting Table X-Y Range | 250mm×270mm |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Weight | GW.≈47kg,NW.≈70kg |
| Footprint | ≤620mm x 640mm x 450mm(W x D x H) |