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S450-B

■ Close loop force control 

■ EFO controlled by CPLD 

■ DSP phase lock,stable ultrasonic output

■ Drive by electricity without compressed air

■ Self-study Chinese GUl for advanced process

■ Unique tailless bumping process and super adaptability for soft substrates 

■ Bond head designed by parallelogram support large module of deep access


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Specification

■ Application:Discrete, Microwave Module, Laser, Optical Communication Devices, Sensors, 

                         MEMS, SAW, RF Components, Power Device, etc.

■ Bond Wire:Au(15~75μm),Pt(18~25μm),Ag(18~50μm)

■ Device Depth:Max:15mm

■ Spool:1/2 inch or 2 inch

■ Bond Head Z Range:19mm

■ Bond Head X-Y Range:X=15mm,Y=15mm

■ Lifting Table Z Range:0~19mm

■ Lifting Table X-Y Range:268mm×273mm

■ Bond Power:Numerical control,1000x subdivision

■ Bond Force:0~250g

■ Type of Bonding Tools:19mm/16mm

■ Clamping Table:Maximum Temperature 200℃

■ Weight:About 47kg


■ Close loop force control 

■ EFO controlled by CPLD 

■ DSP phase lock,stable ultrasonic output

■ Drive by electricity without compressed air

■ Self-study Chinese GUl for advanced process

■ Unique tailless bumping process and super adaptability for soft substrates 

■ Bond head designed by parallelogram support large module of deep access


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