■ Close loop force control
■ EFO controlled by CPLD
■ DSP phase lock,stable ultrasonic output
■ Drive by electricity without compressed air
■ Self-study Chinese GUl for advanced process
■ Unique tailless bumping process and super adaptability for soft substrates
■ Bond head designed by parallelogram support large module of deep access
Specification
■ Application：Discrete, Microwave Module, Laser, Optical Communication Devices, Sensors,
MEMS, SAW, RF Components, Power Device, etc.
■ Bond Wire：Au(15~75μm),Pt(18~25μm),Ag(18~50μm)
■ Device Depth：Max:15mm
■ Spool：1/2 inch or 2 inch
■ Bond Head Z Range：19mm
■ Bond Head X-Y Range：X=15mm,Y=15mm
■ Lifting Table Z Range：0~19mm
■ Lifting Table X-Y Range：268mm×273mm
■ Bond Power：Numerical control,1000x subdivision
■ Bond Force：0~250g
■ Type of Bonding Tools：19mm/16mm
■ Clamping Table：Maximum Temperature 200℃
■ Weight：About 47kg
■ Close loop force control
■ EFO controlled by CPLD
■ DSP phase lock,stable ultrasonic output
■ Drive by electricity without compressed air
■ Self-study Chinese GUl for advanced process
■ Unique tailless bumping process and super adaptability for soft substrates
■ Bond head designed by parallelogram support large module of deep access
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