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S450P-W

■ High precision close loop force control (Accuracy within 1g)

■ High stability of bond point

■ One key switch frequency

■ Drive by electricity without compressed air

■ Unique tailless bumping process and super adaptability for soft substrates 

■ Bond head designed by parallelogram support large module of deep access



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Specification

■ Application:Discrete, Microwave Module, Laser, Optical Communication Devices, Sensors, 

                         MEMS, SAW, RF Components, Power Device, etc.

■ Bond Wire:Al(18~100μm),Au(15~75μm),Gold Ribbon(12.7x50μm~25.4x300μm),Specific alloy wire

■ Device Depth:Max:21mm

■ Spool:1/2 inch or 2 inch

■ Bond Head Z Range:19mm

■ Bond Head X-Y Range:X=15mm,Y=15mm

■ Lifting Table Z Range:0~19mm

■ Lifting Table X-Y Range:268mm×273mm

■ Bond Power:Numerical control,1000x subdivision

■ Bond Force:0~250g

■ Type of Bonding Tools:25mm/19mm

■ Clamping Table:Maximum Temperature 200℃

■ Weight:About 47kg





■ High precision close loop force control (Accuracy within 1g)

■ High stability of bond point

■ One key switch frequency

■ Drive by electricity without compressed air

■ Unique tailless bumping process and super adaptability for soft substrates 

■ Bond head designed by parallelogram support large module of deep access



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