HIGH ACCURACY EPOXY DIE ATTACH
DA0300SE
FEATURES:
1. Flexible multi reference patch
2. High precision force control, with an accuracy of ±1g
3. High-speed and high-precision Dual driven Gantry System
4. Transfer station assisted high-precision positioning function
5. High precision up-look and down-look vision positioning system
6. Pipeline operation in the placement machine, with optional workbench mode
7. High precision Pre-Pattern and flexible dispensing,
8. Support overlay of dispensing patterns
9. Integrated online contact height measurement,dispensing needle height measurement is also available(Optional)
TECHNICAL SPECIFICATION
Positioning Accuracy | ±3μm@3sigma |
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Angular Accuracy | ±0.15° |
Height Measurement Accuracy | ±1μm |
Force Control Accuracy | ±1g |
Stroke | X=386mm,Y=716mm,Z=50mm |
Die Size | Min. 0.38mm x 0.38mm,Max. 7mm x 7mm |
Waffle Pack/Gel-Pak size | 2 inches,compatible with 4 inches |
Waffle Pack/Gel-Pak Quantity | 18x (2 inches) , 2x (4 inches),or26x(2 inches) |
Nozzle Quantity | 12(Including height measurement) |
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Height Measurement Method | Contact Measurement |
Adhesive Type | Epoxy |
Epoxy Volume | 3cc、5cc、10cc |
Minimum adhesive spot diameter | ∅0.3mm |
Bonding Force | 10~690g |
Operating System | Windows |
Weight | 1.6T |
FACILITY REQUIREMENT
Power Input | 220V±10%@50/60Hz |
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Power Consumption | 2KW |
Footprint | 970mm x 1570mm x 2040mm (W x D x H) |
Air Pressure | 0.4 ~ 0.6MPa |
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Vacuum Pressure | ≤ -85kPa |