die attach
HIGH ACCURACY EPOXY DIE ATTACH

DA0300SE

FEATURES:

1. Flexible multi reference patch
2. High precision force control, with an accuracy of ±1g
3. High-speed and high-precision Dual driven Gantry System
4. Transfer station assisted high-precision positioning function
5. High precision up-look and down-look vision positioning system
6. Pipeline operation in the placement machine, with optional workbench mode
7. High precision Pre-Pattern and flexible dispensing,
8. Support overlay of dispensing patterns
9. Integrated online contact height measurement,dispensing needle height measurement is also available(Optional)

TECHNICAL SPECIFICATION

Positioning Accuracy±3μm@3sigma
Angular Accuracy±0.15°
Height Measurement Accuracy±1μm
Force Control Accuracy±1g
StrokeX=386mm,Y=716mm,Z=50mm
Die SizeMin. 0.38mm x 0.38mm,Max. 7mm x 7mm
Waffle Pack/Gel-Pak size2 inches,compatible with 4 inches
Waffle Pack/Gel-Pak Quantity18x (2 inches) , 2x (4 inches),or26x(2 inches)
Nozzle Quantity12(Including height measurement)
Height Measurement MethodContact Measurement
Adhesive TypeEpoxy
Epoxy Volume3cc、5cc、10cc
Minimum adhesive spot diameter∅0.3mm
Bonding Force10~690g
Operating SystemWindows
Weight1.6T

FACILITY REQUIREMENT

Power Input220V±10%@50/60Hz
Power Consumption2KW
Footprint970mm x 1570mm x 2040mm (W x D x H)
Air Pressure0.4 ~ 0.6MPa
Vacuum Pressure≤ -85kPa

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