Exhibition Preview | CHInano 2024 – 尚进自动化

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Exhibition Preview | CHInano 2024

2024-9-29

focus on semiconductor packaging equipment

(+86) 0574 - 88059503

zhangmj@shangjincn.com

Solutions

Microwave
Optical/Sensors/MEMS
Large Scale Integrated Circuit
Power Module

Products

Multi-functional Wire Bonder
Fully Automatic Wire Bonder
Fully Automatic Deep Access Wire Bonder
Fully Automatic Heavy Wire Wedge Bonder
Fully Automatic Die Attach
Heated Clamping Table Series

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