Number of Positions: 2        Work Location: Zhejiang, China

Mechanical Engineer

Responsibility

1. Develop relevant production process flows for related products, guide and propose improvement plans, optimize the chip mounting process, improve production efficiency, and reduce costs.
2. Establish and test production processes for new products and new equipment, ensuring the reliability and stability of the processes.
3. Analyze and assess the state of related processes based on equipment performance and provide timely feedback to R&D personnel for continuous process optimization to improve yield and capacity.
4. Troubleshoot various complex issues and conduct root cause analysis to solve various process problems.
5. Establish, maintain, and improve relevant standards, processes, and specifications for the chip mounting process, promoting the standardization and normalization of process parameters, and participate in training and mentoring new employees.
6. Collaborate with development engineers to provide effective suggestions for the development and debugging of new equipment and support subsequent process adjustments and optimizations.
7. Communicate with customers, and if necessary, travel to customer sites for equipment installation, debugging, sampling, and assistance in resolving on-site issues or provide remote support from other locations within the company.

Qualifications

1. Bachelor's degree or above, with a background in science and engineering.
2. Familiarity with semiconductor packaging processes related to die bonding.
3. Basic knowledge of chip mounting processes, with a willingness to learn.
4. Experience with semiconductor automated equipment and chip mounters is preferred.

Resume Submission:hr@shangjincn.com