Work Location: Ningbo·China
Semiconductor Equipment Process Engineer
1、Develop and optimize production processes for related products, provide guidance and improvement solutions, refine die-bonding workflows, enhance production efficiency, and reduce costs.
2、Establish and prototype production processes for new products and equipment, ensuring reliability and stability.
3、Analyze, evaluate, and optimize process conditions based on equipment performance, provide timely feedback to R&D, and continuously improve processes to increase yield and productivity.
4、Troubleshoot complex issues, perform root cause analysis, and resolve various process-related problems.
5、Establish, maintain, and improve die-bonding process standards, procedures, and specifications, promote standardization of process parameters, and participate in training and mentoring new employees.
6、Collaborate with development engineers to provide effective suggestions for new equipment R&D and debugging, as well as subsequent process adjustments and optimizations.
7、Communicate with customers, travel to customer sites when necessary for equipment installation, debugging, sampling, and on-site issue resolution, or provide cross-site support within the company.
1、Bachelor’s degree or higher in a STEM (Science, Technology, Engineering, Mathematics) field.
2、Familiarity with semiconductor packaging die-bonding processes.
3、Basic knowledge of die-bonding processes and a willingness to learn.
4、Experience with semiconductor automated die-bonding equipment is preferred.