High Accuracy Wafer Level Epoxy Die Attach
AP0300WE
FEATURES：
1. 3D stacking up to 5mm
2. Class 100 Cleanroom (Optional)
3. Wafer Mapping system
4. Real time correction of visual center
5. Flexible multi reference patch
6. High accuracy wafer level packaging
7. Integrated online contact height measurement
8. High and low magnification dual field vision system
9. High-speed and high-precision Dual driven Gantry System
10. Expandable for traditional Die attach（C2S）, and Die sorting
11. High precision Pre-Pattern and flexible dispensing，support overlay of dispensing patterns
TECHNICAL SPECIFICATION
| Positioning Accuracy | ±3μm@3sigma |
|---|---|
| Angular Accuracy | ±0.15° |
| Height Measurement Accuracy | ±1μm |
| Force Control Accuracy | ±1g |
| Stroke | X=360mm ,Y=657mm, Z= 30mm |
| Die Size | Min. 0.38mm x 0.38mm，Max. 7mm x 7mm |
| Waffle Pack/Gel-Pak size | 2 inches |
| Waffle Pack/Gel-Pak Quantity | 20x，Max 30x（Optional) |
| Nozzle Quantity | 12（Including height measurement） |
|---|---|
| Height Measurement Method | Contact Measurement |
| Adhesive Type | Epoxy |
| Epoxy Volume | 3cc、5cc、10cc |
| Minimum adhesive spot diameter | ∅0.3mm |
| Bonding Force | 10~200g |
| Operating System | Windows |
| Weight | 1.6T |
FACILITY REQUIREMENT
| Power Input | 220V±10%@50/60Hz |
|---|---|
| Power Consumption | 2KW |
| Footprint | 970mm x 1570mm x 2040mm (W x D x H) |
| Air Pressure | 0.4 ~ 0.6MPa |
|---|---|
| Vacuum Pressure | ≤ -85kPa |