MULTI-FUNCTIONAL WIRE BONDER(BALL)
S450P-B
FEATURES：
1. High precision close loop force control(accuracy within 1g)
2. Support high/low frequency transducer
3. One key switch high/low power
4. Drive by electricity without compressed air
5. Unique tailless bumping process
6. Bond head designed by parallelogram support large module of deep access
TECHNICAL SPECIFICATION
| Bond Wire | Au(15~75μm),Pt(18~25μm), Cu(18~50μm),Ag(18~50μm) |
|---|---|
| Device Depth | Max:15mm |
| Type of Bonding Tools | 19mm、16mm |
| Spool | Standard :1/2 inch；Optional : 2 inch |
| Bond Force | 1~250g |
| Bond Power | Numerical control,1000x subdivision |
| Clamping Table | Maximum Temperature 200℃ |
| Bond Head Z Range | 18mm |
|---|---|
| Bond Head X-Y Range | X=15mm,Y=15mm |
| Lifting Table Z Range | 0~18mm |
| Lifting Table X-Y Range | 250mm×270mm |
| Input Voltage | 220V±10%@50~60Hz |
| Power Consumption | ≤500W |
| Weight | GW.≈47kg,NW.≈70kg |
| Footprint | ≤620mm x 640mm x 450mm(W x D x H) |